HOTLINE :: Printed Circuit Boards

Product	GA	Application
03007 Bright Copper SLOTOCOUP CU 40	33 KB	Application in vertical plating lines. Deposition of bright coatings with low internal stress and optimal breaking elongation.
03019 Copper Bath SLOTOCOUP CU 50	32 KB	Application in vertical plating lines. Pattern plating. Deposits with excellent metal distribution and throwing power.
03025 Bright Copper SLOTOCOUP CU 80	30 KB	Application in vertical and horizontal continuous plating lines. Deposition of fine-grained and ductile coatings. Cathodic current density up to 10 A/dm2.
03026 Copper Bath SLOTOCOUP HL 10	31 KB	Application in horizontal continuous plating lines. Especially suitable for periodic reverse current (reverse pulse plating).
03311 Bright Copper SLOTOCOUP BV 110	150 KB	Application in vertical plating lines. One-step process for filling blind microvias, pattern plating and through-hole metallisation.
03802 Copper Bath SLOTOCOUP CU 110	32 KB	Application in vertical plating lines. Suitable for periodic reverse pulse plating.
03814 Copper Bath SLOTOCOUP CU 140	29 KB	Application in vertical plating lines. For through-hole plating and metallisation (not filling) of blind microvias.

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