| Product | GA | Application |
|---|---|---|
| 03007 SLOTOCOUP CU 40 Bright Copper |  37 KB | Application in vertical plating lines. Deposition of bright coatings with low internal stress and optimal breaking elongation. |
| 03019 SLOTOCOUP CU 50 Copper Bath | Application in vertical plating lines. Pattern plating. Deposits with excellent metal distribution and throwing power. | |
| 03025 SLOTOCOUP CU 80 Bright Copper | 36 KB | Application in vertical and horizontal continuous plating lines. Deposition of fine-grained and ductile coatings. Cathodic current density up to 10 A/dm2. |
| 03026 SLOTOCOUP HL 10 Copper Bath | 37 KB | Application in horizontal continuous plating lines. Especially suitable for periodic reverse current (reverse pulse plating). |
| 03032 SLOTOCOUP SF 20 Copper | 36 KB | For production of HDI-PCBs in order to achieve superfilling of blind microvias with copper and a min. copper thicknesson the surface. |
| 03105 SLOTOCOUP BV 50 Copper | 38 KB | For production of HDI-PCBs in order to fill blind microvias with copper, pattern plating, metallize through holes in a one step process. |
| 03311 SLOTOCOUP BV 110 Bright Copper | 37 KB | Application in vertical plating lines. One-step process for filling blind microvias, pattern plating and through-hole metallisation. |
| 03802 SLOTOCOUP CU 110 Copper Bath | 32 KB | Application in vertical plating lines. Suitable for periodic reverse pulse plating. |
| 03814 SLOTOCOUP CU 140 Copper Bath | 36 KB | Application in vertical plating lines. For through-hole plating and metallisation (not filling) of blind microvias. |
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