ProductTDSApplication
03007 Bright Copper
SLOTOCOUP CU 40
Application in vertical plating lines. Deposition of bright coatings with low internal stress and optimal breaking elongation.
03019 Copper Bath
SLOTOCOUP CU 50
Application in vertical plating lines.  Pattern plating.  Deposits with excellent metal distribution and throwing power.
03025 Bright Copper
SLOTOCOUP CU 80
Application in vertical and horizontal continuous plating lines.  Deposition of fine-grained and ductile coatings.  Cathodic current density up to 10 A/dm2.
03026 Copper Bath
SLOTOCOUP HL 10
Application in horizontal continuous plating lines.  Especially suitable for periodic reverse current (reverse pulse plating).
03032 Copper
SLOTOCOUP SF 20
For production of HDI-PCBs in order to achieve superfilling of blind microvias with copper and a min. copper thicknesson the surface.
03033 Copper
SLOTOCOUP SF 30
SuperFilling copper electrolyte for the application in vertical plants, especially for the filling of Blind Microvias and even lower layer thickness on the suface of the PCB than SLOTOCOUP SF 20.
03105 Copper
SLOTOCOUP BV 50
For production of HDI-PCBs in order to fill blind microvias with copper, pattern plating, metallize through holes in a one step process.
03311 Bright Copper
SLOTOCOUP BV 110
Application in vertical plating lines.  One-step process for filling blind microvias, pattern plating and through-hole metallisation.
03810 Copper
SLOTOCOUP PRT 120 D
Electrolyte developed for copper plating of PCBs if processes of direct plating are applied. Can also be used as RRP electrolyte.
03812 Copper
SLOTOCOUP PRT 120
This electrolyte uses the the advantages of Reverse Pulse Plating (RPP) in connection with vertical reel-to-reel plating plants optimally.
03814 Copper
SLOTOCOUP CU 140
Application in vertical plating lines. For through-hole plating and metallisation (not filling) of blind microvias.
03821 Copper
SLOTOCOUP CU 210
In combination with RRP SLOTOCOUP CU 210 enables a excellent metal distribution in through holes. SLOTOCOUP CU 210 can also be operated with direct current (DC).
03824 Copper
SLOTOCOUP CU 240
Copper SLOTOCOUP CU 240 was especially developed for the PCB industry. It’s used for plating but not for filling of blind microvias and is also well suited for metallization of through holes.

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