ProductTDSApplication
11000 Tin-Lead
LA
Borofluoric acid based electrolyte for PCB and electronic components. Deposits fine crystalline coatings with approx. 60 % tin in the alloy.
11003 Lead-Tin Copper
SLOTOLET CSP 10 1
Acidic fluoride-free electrolyte for the deposition of the ternary alloy system lead-tin-copper. Even thick coatings are free of dendrites.
11004 Tin-Lead
SLOTOLET KB 10
Acidic and low-foaming tin-lead bath for continuous plating lines.
11013 Tin-Lead
SLOTOLET KB 30
Process for subsequent plating of IC packages (trim and form process).
11022 Tin-Copper
SLOTOLOY SNC 20
Sulphate-free electrolyte giving a fine crystalline, matt deposit of a tin-copper alloy with a co-deposition of about 1 - 10% copper.  The tendency to form whiskers is reduced.
11025 Tin-Silver
SLOTOLOY SNA 30
Strong acidic electrolyte for the deposition of satin-matt fine-crystalline tin-silver layers with approximately 3% silver co-deposition in the alloy.  Suitable for rack, barrel and reel-to-reel applications.
11042 Tin-Lead
SLOTOLET KB
Process for rack- and reel-to-reel plating lines. 5 - 90 % lead.
11048 Bright Tin-Lead
SLOTOLET GB 20
Deposits low-carbon layers with 5 - 10 % lead in continuous plating lines.
11053 Tin-Lead
SLOTOLET GB 60
Fluoride- and formalin-free electrolyte for the deposition of bright tin-lead coatings, primarily for alloys containing 5 - 40% lead. Mainly used in reel-to-reel installations.
11072 Matt Lead
MSN 10 1
Multi-purpose, strong acidic and fluoride-free electrolyte for the deposition of smooth and dendrite-free coatings, even when thick layers of 200 µm or more are deposited.
11097 Tin-Lead
SLOTOLET KB 20
Fluoride-free electrolyte for plating of IC-lead frames in high-speed installations.
11201 Tin-Lead
SLOTOLET K 10 1
Strong acidic fluoride-free electrolyte for the deposition of matt layers with 5-10% lead in the alloy. The alloy is stable over a wide current density range.
11222 Bright Tin-Lead
SLOTOLET G 20 1
Fluoride- and formaldehyde-free electrolyte, based on organic acid, for the deposition of bright tin-lead coatings, for alloys containing 5 - 10 % lead.
11223 Bright Tin-Lead
SLOTOLET G 30 1
Fluoride- and formaldehyde-free electrolyte for the deposition of bright tin-lead coatings, for alloys containing up to 40% lead.
11224 Bright Tin-Lead
SLOTOLET G 40 1
Fluoride and formaldehyde free process for the deposition of superbright tin-lead coatings with up to 40% lead in the alloy.
11225 Tin-Lead
SLOTOLET G 50 1
Strong acidic, fluoride-free electrolyte based on alkyl sulphonic acids for the deposition of bright tin lead coatings. Haze-free bright coatings are easily achieved with 5 - 35 % lead in the alloy.
11304 Tin-Bismuth
SLOTOLOY SNB 30 1
The strongly acidic tin-bismuth alloy electrolyte is for the deposition of silky matt Sn-Bi alloys with an bismuth co-deposition rate of up to 5 %.
11401 Tin-Nickel
SLOTOLOY NIT 10
Deposits brightness-retaining alloy coatings composed of approx. 65% tin and 35% nickel. Can be run on a wide current density range, approx. 0.1 - 5.0 A/dm². Suitable for for rack and barrel plating.

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