| 11000 Tin-Lead LA | | Bborofluoric acid based electrolyte for PCB and electronic components. Deposits fine crystalline coatings with ~ 60 % tin in the alloy. |
11003 Alloy Bath
SLOTOLET CSP 10 1 | 
149 KB | Acidic fluoride-free electrolyte for the deposition of the ternary alloy system lead-tin-copper. Even thick coatings are free of dendrites. |
11004 Tin-Lead
SLOTOLET KB 10 |
149 KB | Acidic and low-foaming tin-lead bath for continuous plating lines. |
11013 Tin-Lead
SLOTOLET KB 30 |
187 KB | Process for subsequent plating of IC packages (trim and form process). |
11022 Tin-Copper
SLOTOLOY SNC 20 |
189 KB | Sulphate-free electrolyte giving a fine crystalline, matt deposit of a tin-copper alloy with a co-deposition of about 1 - 10% copper. The tendency to form whiskers is reduced. |
11025 Tin-Silver
SLOTOLOY SNA 30 |
194 KB | Strong acidic electrolyte for the deposition of satin-matt fine-crystalline tin-silver layers with approximately 3% silver co-deposition in the alloy. Suitable for rack, barrel and reel-to-reel applications. |
11042 Tin-Lead
SLOTOLET KB | | Process for rack- and reel-to-reel plating lines. 5 - 90 % lead. |
11048 Bright Tin-Lead
SLOTOLET GB 20 |
188 KB | Deposits low-carbon layers with 5 - 10 % lead in continuous plating lines. |
11053 Tin-Lead
SLOTOLET GB 60 |
188 KB | Fluoride- and formalin-free electrolyte for the deposition of bright tin-lead coatings, primarily for alloys containing 5 - 40% lead. Mainly used in reel-to-reel installations. |
| 11072 Matt Lead MSN 10-1 |
196 KB | Multi-purpose, strong acidic and fluoride-free electrolyte for the deposition of smooth and dendrite-free coatings, even when thick layers of 200 µm or more are deposited. |
11097 Tin-Lead
SLOTOLET KB 20 |
187 KB | Fluoride-free electrolyte for plating of IC-lead frames in high-speed installations. |
11201 Tin-Lead
SLOTOLET K 10-1 |
187 KB | Strong acidic fluoride-free electrolyte for the deposition of matt layers with 5-10% lead in the alloy. The alloy is stable over a wide current density range. |
11222 Bright Tin-Lead
SLOTOLET G 20-1 |
188 KB | Fluoride- and formaldehyde-free electrolyte, based on organic acid, for the deposition of bright tin-lead coatings, for alloys containing 5 - 10 % lead. |
11223 Bright Tin-Lead
SLOTOLET G 30-1 | | Fluoride- and formaldehyde-free electrolyte for the deposition of bright tin-lead coatings, for alloys containing up to 40% lead. |
11224 Bright Tin-Lead
SLOTOLET G 40-1 |
188 KB | Fluoride and formaldehyde free process for the deposition of superbright tin-lead coatings with up to 40% lead in the alloy. |
11225 Tin-Lead
SLOTOLET G 50-1 |
188 KB | Strong acidic, fluoride-free electrolyte based on alkyl sulphonic acids for the deposition of bright tin lead coatings. Haze-free bright coatings are easily achieved with 5 - 35% lead in the alloy. |
