| Product | GA | Application |
|---|---|---|
| 11000 Tin-Lead LA |  36 KB | Borofluoric acid based electrolyte for PCB and electronic components. Deposits fine crystalline coatings with approx. 60 % tin in the alloy. |
| 11003 SLOTOLET CSP 10 1 Alloy Bath | 149 KB | Acidic fluoride-free electrolyte for the deposition of the ternary alloy system lead-tin-copper. Even thick coatings are free of dendrites. |
| 11004 SLOTOLET KB 10 Tin-Lead | 149 KB | Acidic and low-foaming tin-lead bath for continuous plating lines. |
| 11013 SLOTOLET KB 30 Tin-Lead | 187 KB | Process for subsequent plating of IC packages (trim and form process). |
| 11022 SLOTOLOY SNC 20 Tin-Copper | 189 KB | Sulphate-free electrolyte giving a fine crystalline, matt deposit of a tin-copper alloy with a co-deposition of about 1 - 10% copper. The tendency to form whiskers is reduced. |
| 11025 SLOTOLOY SNA 30 Tin-Silver | 39 KB | Strong acidic electrolyte for the deposition of satin-matt fine-crystalline tin-silver layers with approximately 3% silver co-deposition in the alloy. Suitable for rack, barrel and reel-to-reel applications. |
| 11042 SLOTOLET KB Tin-Lead | Process for rack- and reel-to-reel plating lines. 5 - 90 % lead. | |
| 11048 SLOTOLET GB 20 Bright Tin-Lead | 188 KB | Deposits low-carbon layers with 5 - 10 % lead in continuous plating lines. |
| 11053 SLOTOLET GB 60 Tin-Lead | 188 KB | Fluoride- and formalin-free electrolyte for the deposition of bright tin-lead coatings, primarily for alloys containing 5 - 40% lead. Mainly used in reel-to-reel installations. |
| 11072 Matt Lead MSN 10 1 | 196 KB | Multi-purpose, strong acidic and fluoride-free electrolyte for the deposition of smooth and dendrite-free coatings, even when thick layers of 200 µm or more are deposited. |
| 11097 SLOTOLET KB 20 Tin-Lead | 187 KB | Fluoride-free electrolyte for plating of IC-lead frames in high-speed installations. |
| 11201 SLOTOLET K 10 1 Tin-Lead | 187 KB | Strong acidic fluoride-free electrolyte for the deposition of matt layers with 5-10% lead in the alloy. The alloy is stable over a wide current density range. |
| 11222 SLOTOLET G 20 1 Bright Tin-Lead | 188 KB | Fluoride- and formaldehyde-free electrolyte, based on organic acid, for the deposition of bright tin-lead coatings, for alloys containing 5 - 10 % lead. |
| 11223 SLOTOLET G 30 1 Bright Tin-Lead | Fluoride- and formaldehyde-free electrolyte for the deposition of bright tin-lead coatings, for alloys containing up to 40% lead. | |
| 11224 SLOTOLET G 40 1 Bright Tin-Lead | 188 KB | Fluoride and formaldehyde free process for the deposition of superbright tin-lead coatings with up to 40% lead in the alloy. |
| 11225 SLOTOLET G 50 1 Tin-Lead | 188 KB | Strong acidic, fluoride-free electrolyte based on alkyl sulphonic acids for the deposition of bright tin lead coatings. Haze-free bright coatings are easily achieved with 5 - 35 % lead in the alloy. |
| 11304 SLOTOLOY SNB 30 1 Tin-Bismuth | 149 KB | Highly acidic, fluoride-free electrolyte used to deposit dull, silky tin-bismuth coatings containing up to 5% Bismuth. |
| 11401 SLOTOLOY NIT 10 Tin-Nickel | 35 KB | Deposits brightness-retaining alloy coatings composed of approx. 65% tin and 35% nickel. Can be run on a wide current density range, approx. 0.1 - 5.0 A/dm². Suitable for for rack and barrel plating. |
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