ProductGAApplication
18007 Activator PDI
PDF
142 KB 		Ionogenic activator for activating non-conductors for subsequent metal deposition.  The activator contains palladium.
18021 SLOTOCHEM CU 10
Electroless Copper		Electroless process for the deposition of copper coatings (< 1 µm) onto non-conductive material.
18103 SLOTOCHEM NI 30
Post Treatment		PDF
36 KB 		Allows soldering of electroless nickel deposits and is especially recommended for Electroless Nickel SLOTONIP 90.
18122 SLOTONIP VN 20
Electroless Nickel		PDF
148 KB 		Electrolyte for an initial electroless nickel coating on aluminium after zincate pre-treatment.

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