ProductTDSApplication
18007 Activator PDI 10
Ionogenic activator for activating non-conductors for subsequent metal deposition.  The activator contains palladium.
18022 Fungizide
Additive SLOTONIP PZ 11
Fungicide for electroless nickel electrolytes
18101 Post Treatment
SLOTOCHEM NI 10
Post-treatment for electroless Ni layers on Pd basis to improve the solderability
18103 Post Treatment
SLOTOCHEM NI 30
Allows soldering of electroless nickel deposits and is especially recommended for Electroless Nickel SLOTONIP 90.
18122 Electroless Nickel
SLOTONIP VN 20
Electrolyte for an initial electroless nickel coating on aluminium after zincate pre-treatment.

HOTLINE

If you have specific questions about our processes or need some other information, just complete the form below and send it to us.

Kontaktformular Verfahren
CAPTCHA image for SPAM prevention If you can't read the word, click here.

Or just call us:  +49 (0)7331 205-0