| Product | TDS | Application |
|---|---|---|
| 03007 Bright Copper SLOTOCOUP CU 40 |  39 KB | Application in vertical plating lines. Deposition of bright coatings with low internal stress and optimal breaking elongation. |
| 03019 Copper Bath SLOTOCOUP CU 50 | Application in vertical plating lines. Pattern plating. Deposits with excellent metal distribution and throwing power. | |
| 03025 Bright Copper SLOTOCOUP CU 80 | Application in vertical and horizontal continuous plating lines. Deposition of fine-grained and ductile coatings. Cathodic current density up to 10 A/dm2. | |
| 03026 Copper Bath SLOTOCOUP HL 10 | 34 KB | Application in horizontal continuous plating lines. Especially suitable for periodic reverse current (reverse pulse plating). |
| 03032 Copper SLOTOCOUP SF 20 | 30 KB | For production of HDI-PCBs in order to achieve superfilling of blind microvias with copper and a min. copper thicknesson the surface. |
| 03033 Copper SLOTOCOUP SF 30 | 34 KB | SuperFilling copper electrolyte for the application in vertical plants, especially for the filling of Blind Microvias and even lower layer thickness on the suface of the PCB than SLOTOCOUP SF 20. |
| 03096 Copper SLOTOCOUP SF 1960 | 211 KB | |
| 03105 Copper SLOTOCOUP BV 50 | 37 KB | For production of HDI-PCBs in order to fill blind microvias with copper, pattern plating, metallize through holes in a one step process. |
| 03145 Copper SLOTOCOUP CU 1370 | 34 KB | Elektrolyte operated with DC, enables very good throwing power in high aspect ratio holes. |
| 03150 Copper SLOTOCOUP CU 1450 | 25 KB | |
| 03172 Copper SLOTOCOUP CN 1720 | 33 KB | |
| 03180 Copper SLOTOCOUP CF 1800 | 31 KB | |
| 03196 Copper SLOTOCOUP SF 40 | 30 KB | |
| 03215 Copper SLOTOCOUP ME 2150 | 34 KB | |
| 03311 Bright Copper SLOTOCOUP BV 110 | 34 KB | Application in vertical plating lines. One-step process for filling blind microvias, pattern plating and through-hole metallisation. |
| 03810 Copper SLOTOCOUP PRT 120 D | 30 KB | Electrolyte developed for copper plating of PCBs if processes of direct plating are applied. Can also be used as RRP electrolyte. |
| 03812 Copper SLOTOCOUP PRT 120 | 38 KB | This electrolyte uses the the advantages of Reverse Pulse Plating (RPP) in connection with vertical reel-to-reel plating plants optimally. |
| 03814 Copper SLOTOCOUP CU 140 | 34 KB | Application in vertical plating lines. For through-hole plating and metallisation (not filling) of blind microvias. |
| 03821 Copper SLOTOCOUP CU 210 | 38 KB | In combination with RRP SLOTOCOUP CU 210 enables a excellent metal distribution in through holes. SLOTOCOUP CU 210 can also be operated with direct current (DC). |
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