| Product | TDS | Application |
|---|---|---|
| 11000 Tin-Lead LA |  38 KB | Borofluoric acid based electrolyte for PCB and electronic components. Deposits fine crystalline coatings with approx. 60 % tin in the alloy. |
| 11003 Lead-Tin-Copper SLOTOLET CSP 10 1 | 37 KB | Acidic fluoride-free electrolyte for the deposition of the ternary alloy system lead-tin-copper. Even thick coatings are free of dendrites. |
| 11004 Tin-Lead SLOTOLET KB 10 | Acidic and low-foaming tin-lead bath for continuous plating lines. | |
| 11013 Tin-Lead SLOTOLET KB 30 | 187 KB | Process for subsequent plating of IC packages (trim and form process). |
| 11022 Tin-Copper SLOTOLOY SNC 20 | 189 KB | Sulphate-free electrolyte giving a fine crystalline, matt deposit of a tin-copper alloy with a co-deposition of about 1 - 10% copper. The tendency to form whiskers is reduced. |
| 11025 Tin-Silver SLOTOLOY SNA 30 | 26 KB | Strong acidic electrolyte for the deposition of satin-matt fine-crystalline tin-silver layers with approximately 3% silver co-deposition in the alloy. Suitable for rack, barrel and reel-to-reel applications. |
| 11042 Tin-Lead SLOTOLET KB | Process for rack- and reel-to-reel plating lines. 5 - 90 % lead. | |
| 11048 Bright Tin-Lead SLOTOLET GB 20 | 25 KB | Deposits low-carbon layers with 5 - 10 % lead in continuous plating lines. |
| 11053 Tin-Lead SLOTOLET GB 60 | 25 KB | Fluoride- and formalin-free electrolyte for the deposition of bright tin-lead coatings, primarily for alloys containing 5 - 40% lead. Mainly used in reel-to-reel installations. |
| 11072 Lead MSN 10 1 | 69 KB | Multi-purpose, strong acidic and fluoride-free electrolyte for the deposition of smooth and dendrite-free coatings, even when thick layers of 200 µm or more are deposited. |
| 11097 Tin-Lead SLOTOLET KB 20 | 187 KB | Fluoride-free electrolyte for plating of IC-lead frames in high-speed installations. |
| 11201 Tin-Lead SLOTOLET K 10 1 | 26 KB | Strong acidic fluoride-free electrolyte for the deposition of matt layers with 5-10% lead in the alloy. The alloy is stable over a wide current density range. |
| 11222 Bright Tin-Lead SLOTOLET G 20 1 | 26 KB | Fluoride- and formaldehyde-free electrolyte, based on organic acid, for the deposition of bright tin-lead coatings, for alloys containing 5 - 10 % lead. |
| 11223 Bright Tin-Lead SLOTOLET G 30 1 | Fluoride- and formaldehyde-free electrolyte for the deposition of bright tin-lead coatings, for alloys containing up to 40% lead. | |
| 11224 Bright Tin-Lead SLOTOLET G 40 1 | 188 KB | Fluoride and formaldehyde free process for the deposition of superbright tin-lead coatings with up to 40% lead in the alloy. |
| 11225 Tin-Lead SLOTOLET G 50 1 | 26 KB | Strong acidic, fluoride-free electrolyte based on alkyl sulphonic acids for the deposition of bright tin lead coatings. Haze-free bright coatings are easily achieved with 5 - 35 % lead in the alloy. |
| 11304 Tin-Bismuth SLOTOLOY SNB 30 1 | 27 KB | The strongly acidic tin-bismuth alloy electrolyte is for the deposition of silky matt Sn-Bi alloys with an bismuth co-deposition rate of up to 5 %. |
| 11401 Tin-Nickel SLOTOLOY NIT 10 | 38 KB | Deposits brightness-retaining alloy coatings composed of approx. 65% tin and 35% nickel. Can be run on a wide current density range, approx. 0.1 - 5.0 A/dm². Suitable for for rack and barrel plating. |
| 13188 Bismuth SLOTOSON MB 1880 | ||
| 13193 Indium SLOTOSON MI 1930 |
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